Developments in Advanced Driver-Assistance Systems (ADAS) are creating a new approach to In-Vehicle Network (IVN) architecture design. With today’s vehicles containing at least a hundred ECUs, the current distributed network architecture has reached the limit of its capabilities. The automotive industry is now focusing on a domain or zonal controller architecture to simplify network design, […]
Handling various complex simulation scenarios with a single simulation method is a rather challenging task for any software suite. We will show you how our software, based on Method-of-Moments, can analyze several scenarios including complicated and electrically large models (for instance, antenna placement and RCS) using desktop workstations. Download this free whitepaper now!
Autonomous systems sit at the intersection of AI, IoT, cloud architectures, and agile software development practices. Various systems are becoming prominent, such as unmanned drones, self-driving cars, automated warehouses, and managing capabilities in smart cities. Little attention has been paid to securing autonomous systems as systems composed of multiple automated components. Various patchwork efforts have […]
Nowadays, electric machines are often driven by power electronic converters. Even though the use of converters brings with it a variety of advantages, common mode (CM) signals are a frequent problem in many installations. Common mode voltages induced by the converter drive common mode currents damage the motor bearings over time and significantly reduce the […]
The extensive use of MIM/MOM capacitors in analog/RF designs presents parasitic extraction challenges to designers. Understanding best practices and recommended tools for extracting the complex geometries of capacitor devices, as well as the in-context coupling effects for those devices in sensitive analog/RF blocks, enables designers to accurately apply the appropriate extraction process to different parts […]
As general purpose chiplet providers offer their devices for use in heterogeneous package designs, manufacturers need a standardized set of design models to ensure operability in electronic design automation (EDA) design workflows. For successful industry-wide 3D IC packaging, these models should be: Electronically readable for use in design workflows Leverage existing industry standards that are […]
One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the technology scaling and cost limitations of monolithic IC design processes. To overcome these challenges, more companies are turning to heterogeneous integration and the 3D stacking of ICs and specialized chiplets (implemented in different processes geometries) into 3D ICs. Chiplets […]
Since introducing the Top 100 Global Innovators list in 2012, each year Clarivate identifies the institutions and companies that sit at the very top of the global innovation ecosystem. Download this free whitepaper now! With each year’s list arises the core question of which organizations could be candidates for entry in future years. In this […]
One thing is clear…tapeouts are getting harder, and taking longer. As part of a growing suite of innovative early-stage design verification technologies, the Calibre nmLVS Recon tool enables design teams to rapidly examine dirty and immature designs to find and fix high-impact circuit errors earlier and faster, leading to an overall reduction in tapeout schedules […]
High-performance computing (HPC) has historically been available primarily to governments, research institutions, and a few very large corporations for modeling, simulation, and forecasting applications. As HPC platforms are being deployed in the cloud for shared services, high-performance computing is becoming much more accessible, and its use is benefiting organizations of all sizes. Increasing investment in […]